| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laser dicing method for optimizing an irradiation condition of a pulse laser beam to obtain excellent cleavage properties in a processed substrate of which a metal film is formed on a surface. <P>SOLUTION: The laser dicing method of the processed substrate including the metal film on the surface thereof includes: a metal film separation step of placing the processed substrate on a stage and irradiating the metal film with the defocused pulse laser beam to separate the metal film; and a crack forming step of irradiating a region where the metal film of the processed substrate is separated with the pulse laser beam to form a crack on the processed substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
