发明名称 EPOXY RESIN MIXTURE, EPOXY RESIN COMPOSITION, PREPREG, AND CURED MATERIAL THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide an epoxy resin exhibiting a high heat conductivity of a cured material thereof, and having excellent moisture resistance. <P>SOLUTION: The epoxy resin contains an epoxy resin (A) obtained by reacting a phenol compound (a) obtained by reacting a specific ketone compound with a specific aldehyde compound, with an epihalohydrin, and further contains an epoxy resin (B) and/or an epoxy resin (C) obtained by reacting at least one of two specific bisphenol compounds with a halohydrin. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013028666(A) 申请公布日期 2013.02.07
申请号 JP20110163910 申请日期 2011.07.27
申请人 NIPPON KAYAKU CO LTD 发明人 KAWAI KOICHI;NAKANISHI MASATAKA;INOUE KAZUMA;EBARA SEIJI
分类号 C08G59/20;C08J5/24;H01L23/29;H01L23/31 主分类号 C08G59/20
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