发明名称 |
EPOXY RESIN MIXTURE, EPOXY RESIN COMPOSITION, PREPREG, AND CURED MATERIAL THEREOF |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin exhibiting a high heat conductivity of a cured material thereof, and having excellent moisture resistance. <P>SOLUTION: The epoxy resin contains an epoxy resin (A) obtained by reacting a phenol compound (a) obtained by reacting a specific ketone compound with a specific aldehyde compound, with an epihalohydrin, and further contains an epoxy resin (B) and/or an epoxy resin (C) obtained by reacting at least one of two specific bisphenol compounds with a halohydrin. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013028666(A) |
申请公布日期 |
2013.02.07 |
申请号 |
JP20110163910 |
申请日期 |
2011.07.27 |
申请人 |
NIPPON KAYAKU CO LTD |
发明人 |
KAWAI KOICHI;NAKANISHI MASATAKA;INOUE KAZUMA;EBARA SEIJI |
分类号 |
C08G59/20;C08J5/24;H01L23/29;H01L23/31 |
主分类号 |
C08G59/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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