| 摘要 |
The invention provides a resin seal device for metal dies which is convenient for cleaning, and high in production efficiency and qualified rate. The resin seal device comprises a resin storage part (23) communicated with an inner cavity (21) through a communicating path (24). The inner cavity (21) is arranged on a lower die of upper and lower dies to be resin sealed through substrate holder with a semiconductor installed on the surface thereof, and the resin storage part (23) is arranged on an up-down movable conveying pin (26). In particular, in the resin storage part (23), the conveying pin (26) is arranged at a position of which the distant to the communicating path (24) makes it impossible that the seal resin directly pushed out by the conveying pin (26) passes through the communicating path (24). |
