| 摘要 |
Provide is a dicing die-bonding film that prevents the occurrence of reflow cracking and that is capable of manufacturing a semiconductor device having excellent reliability with good productivity. The dicing die-bonding film of the present invention comprises at least: a dicing film in which a pressure-sensitive adhesive layer is provided on a support base material; and a die-bonding film that is provided on the pressure-sensitive adhesive layer, wherein the dicing die-bonding film has a water absorption rate of 1.5% by weight or less calculated from the following formula (1). [Numerical Formula 1] [(M2−M1)/M1]×100=Water absorption rate(% by weight)  (1) (wherein, M1 represents the initial weight of the dicing die-bonding film, and M2 represents the weight after the dicing die-bonding film is left under an atmosphere of 85° C. and 85% RH for 120 hours to absorb moisture.)
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