| 摘要 |
A semiconductor device including a substrate having grooves is provided. The semiconductor device includes a substrate including a first surface, a second surface opposite to the first surface, an opening penetrating from the first surface to the second surface, and a first groove formed at a side of the opening, a semiconductor chip formed on the opening at the first surface of the substrate and flip-chip bonded to the first surface by a plurality of first external connection terminals, and a molding unit filling a region between the substrate and the semiconductor chip, filling the opening and filling at least a portion of the first groove, and covering the semiconductor chip. |
