| 摘要 |
<p>The present invention relates to a Cu-Co-Si alloy wire demonstrating improved bendability during notching while maintaining strength and electroconductivity. This highly bendable Cu-Co-Si alloy wire contains 0.5-3.0 wt% of Co, 0.1-1.0 wt% of Si, and copper and inevitable impurities constituting the balance. Even in the surface layer and the central region, the maximum value of the X-ray random intensity ratio on the {200} pole figure is 3.0-15.0 in a range where the angle (a) around an axis perpendicular to the axis of rotation of a diffraction goniometer specified by the Schulz method is 0-10°. A cross section that is parallel both to the rolling direction and to the plate-thickness direction preferably has 20-200 inclusions/mm2, each of the inclusions having a particle diameter of 1-2 µm. The alloy wire optionally contains a total of 0.005-2.5 wt% of one or more elements from Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P, Mn, Ni, and Ag.</p> |
