| 摘要 |
<p>The device has a receiving unit (6) i.e. chuck, for receiving a carrier-wafer composite (21) comprising a carrier (1) and a wafer (4). A connection detaching unit (16), a fluid line (17), an actuator (18), and an actuator arm (29) detach a connection between the carrier and the wafer, and operate in temperature range of 20 to 80 degree Celsius. A wafer pickup unit (9), a pressure line (10), a pickup unit-actuator (11), a vacuum cup (14), a pickup unit-support (15) and a pickup unit-actuator arm (30) detach the wafer from the carrier or the carrier from the wafer. An independent claim is also included for a method for detaching a wafer from a carrier.</p> |
