| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide powder of which the scattering and occurrence of a molding defect can be prevented in molding or filling, and which exhibits sufficient thermal insulation performance, and to provide a molded body, an encapsulated body, and a method for producing the powder. <P>SOLUTION: The powder includes: a plurality of small particles including silica and/or alumina and having an average particle diameter D<SB POS="POST">S</SB>of 5 to 30 nm; and a plurality of large particles including silica and/or alumina and having an average particle diameter D<SB POS="POST">L</SB>of 40 to 100 μm, wherein the ratio R<SB POS="POST">L</SB>of mass of the large particles to the sum total of the mass of the small particles and that of the large particles is 60 to 90 mass%, and thermal conductivity of the powder is 0.05 W/m.K or less at 30°C. <P>COPYRIGHT: (C)2013,JPO&INPIT |
