发明名称 |
INTERCONNECTING MECHANISM FOR 3D INTEGRATED CIRCUIT |
摘要 |
An interconnecting mechanism is provide, which includes paired first sub-interconnecting mechanisms and paired second sub-interconnecting mechanisms. The first pair of sub-interconnecting mechanisms includes first and second axially symmetrical spiral conductive elements. The second pair of sub-interconnecting mechanisms includes third and fourth axially symmetrical spiral conductive elements. Configuring the pairs of sub-interconnecting mechanisms in a differential transmission structure having a spiral shape is used to avert sounds and noise signals between different chips or substrates caused by a miniaturizing fabrication process or an increased wiring density.
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申请公布号 |
US2013034971(A1) |
申请公布日期 |
2013.02.07 |
申请号 |
US201113306051 |
申请日期 |
2011.11.29 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD.;TSAI MING-FAN;LEE HSIN-HUNG;FANG BO-SHIANG;LIN LI-FANG |
发明人 |
TSAI MING-FAN;LEE HSIN-HUNG;FANG BO-SHIANG;LIN LI-FANG |
分类号 |
H01R12/71 |
主分类号 |
H01R12/71 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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