| 摘要 |
Embodiments of the present disclosure relate to compounds, methods of making compositions (used as a linker or a linker moiety), structures having the compound covalently bonded to the surface of the structure, methods of attaching the compound to the surface of the structure having -OH functionality (e.g., Calkyl-OH), methods of decreasing the amount of microorganisms formed on a structure, and the like. |
