发明名称 |
METHOD FOR POLISHING SILICON WAFER AND POLISHING LIQUID THEREFOR |
摘要 |
Disclosed is a method for polishing a silicon wafer, wherein a surface to be polished of a silicon wafer is rough polished, while supplying a polishing liquid, which is obtained by adding a water-soluble polymer to an aqueous alkaline solution that contains no free abrasive grains, to a polishing cloth. Consequently, the surface to be polished can be polished at high polishing rate and the flatness of the edge portion including roll-off and roll-up can be controlled. |
申请公布号 |
US2013032573(A1) |
申请公布日期 |
2013.02.07 |
申请号 |
US201113641546 |
申请日期 |
2011.03.23 |
申请人 |
SUMCO CORPORATION;OGATA SHINICHI;TANIMOTO RYUICHI;YAMASAKI ICHIRO;MIKURIYA SHUNSUKE |
发明人 |
OGATA SHINICHI;TANIMOTO RYUICHI;YAMASAKI ICHIRO;MIKURIYA SHUNSUKE |
分类号 |
B24B1/00;B24B37/04;B24B37/08;B24B37/24;B24B37/28;C09G1/04 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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