EPOXY RESIN COMPOSITION FOR CAST MOLDING AND ELECTRICAL DEVICE USING SAME

摘要

Provided is an epoxy resin composition for cast molding having excellent thermal conductivity and fluidity. This epoxy resin composition for cast molding is characterized in containing: an epoxy resin that has two or more epoxy groups per molecule and is liquid at room temperature; a curing agent for epoxy resin, the curing agent being liquid at room temperature; a tabular inorganic filler; and a spherical inorganic filler; the tabular inorganic filler and the spherical inorganic filler having two or more maxima in the overall particle size distribution, and the mass ratio of the tabular inorganic filler within the total inorganic filler mass found by combining the tabular inorganic filler and the spherical inorganic filler being 5 to 20 mass%.