发明名称 MULTILAYER CERAMIC ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component. <P>SOLUTION: The multilayer ceramic electronic component comprises: a ceramic body including a dielectric layer; and first and second internal electrode layers formed in the ceramic body. The multilayer ceramic electronic component satisfies the relations t<SB POS="POST">d</SB>&le;0.6 &mu;m, (t<SB POS="POST">max</SB>-t<SB POS="POST">min</SB>)/t<SB POS="POST">d</SB><0.30, where the t<SB POS="POST">d</SB>is the average thickness of the dielectric layer, the t<SB POS="POST">max</SB>is the maximum thickness of the first or second internal electrode layer, and the t<SB POS="POST">min</SB>is the minimum thickness. According to the invention, the withstand voltage characteristics are enhanced by equalizing the thickness of the internal electrode layers, and a highly reliable high capacity multilayer ceramic electronic component can be materialized. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013030754(A) 申请公布日期 2013.02.07
申请号 JP20120117534 申请日期 2012.05.23
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM SAN-HAK
分类号 H01G4/30;H01G4/12 主分类号 H01G4/30
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