| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer adhesive sheet for a semiconductor device that has high ion trapping properties and high adhesion to an adhered body. <P>SOLUTION: A multilayer adhesive sheet for a semiconductor device comprises an ion trapping layer formed from an ion trapping composition containing an organic low molecular weight compound forming a complex with a metal ion and an adhesion layer formed from an adhesive composition. <P>COPYRIGHT: (C)2013,JPO&INPIT |
