发明名称 THERMOELECTRIC POWER MODULE
摘要 A thermoelectric power module capable of withstanding a long time use in a high temperature environment where a temperature (Th) of a higher temperature portion exceeds 250° C. The thermoelectric power module includes: a thermoelectric power element; a first diffusion prevention layer consisting of molybdenum (Mo) and disposed on a surface of the thermoelectric power element; a second diffusion prevention layer consisting of an intermetallic compound of nickel-tin (Ni—Sn) and disposed on a surface of the first diffusion prevention layer opposite to the thermoelectric power element side; an electrode; a third diffusion prevention layer consisting of an intermetallic compound of nickel-tin (Ni—Sn) and disposed on a surface of the electrode; a solder layer containing lead (Pb) at not less than 85% and configured to join the second diffusion prevention layer and the third diffusion prevention layer to each other.
申请公布号 US2013032188(A1) 申请公布日期 2013.02.07
申请号 US201113579382 申请日期 2011.02.14
申请人 KAJIHARA TAKESHI;ISHIDA KOUICHI;FUJIMOTO SHINICHI;MIZUKAMI HIROYUKI 发明人 KAJIHARA TAKESHI;ISHIDA KOUICHI;FUJIMOTO SHINICHI;MIZUKAMI HIROYUKI
分类号 H01L35/02 主分类号 H01L35/02
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