OPTICAL COMPONENT PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: An optical device package and a manufacturing method thereof are provided to prevent light traps by using a bonding layer which is exposed by etching a circuit pattern layer and to increase the luminance of the optical device package. CONSTITUTION: A bonding layer is formed on an insulating layer(210) by using a white adhesive. A metal layer(240) is formed on the bonding layer. A circuit pattern layer(242) is formed by etching the metal layer. An optical device is mounted on the circuit pattern layer.