| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting system and an electronic component mounting method which manufacture a substrate, including electronic components, housed in a tray feeder, in mounted objects, at any substrate transfer mechanism without restrictions in the electronic component mounting system including multiple substrate transfer mechanisms. <P>SOLUTION: In an electronic component mounting system 1 formed by connecting electronic component mounting devices M1 to M4A, each of which includes a first substrate transfer mechanism 12A and a second substrate transfer mechanism 12B, the electronic component mounting device M4A includes: a first tray feeder 20A housing electronic components taken out by a first mounting head 15A of a component mounting mechanism, which serves as a first work operation mechanism; and a second tray feeder 20B housing electronic components taken out by a second mounting head 15B of the component mounting mechanism, which serves as a second work operation mechanism. <P>COPYRIGHT: (C)2013,JPO&INPIT |
