| 摘要 |
<P>PROBLEM TO BE SOLVED: To grant allowable operating characteristics by suppressing the heat conduction of a packaged thermistor. <P>SOLUTION: A temperature dependent thermistor element (2) is placed in an electrically insulating package (1). Heat transfer from the thermistor element (2) generating heat to a substrate through the package (1) is suppressed sufficiently by an upper gap (9), a lower gap (7), a peripheral gap (8) and an air layer held in the upper gap (9). <P>COPYRIGHT: (C)2013,JPO&INPIT |
