发明名称 JOINING METHOD AND JOINING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a joining method of a base substance and a lid which deals with the downsizing of the base substrate and the lid and inhibits the occurrence of the distortion without impairing the external appearance, and to provide a joining apparatus conducting the joining method. <P>SOLUTION: In a joining method of this invention, a lid 530 is placed in a package 520 so as to close an opening of a recessed part 521. Further, a plasma electrode 130 is disposed forming a space with the lid 530, and a ground electrode 140 is placed in connection with the lid 530. Then, plasma glow discharge P is caused by applying a voltage to a plasma electrode 130 while supplying a process gas to the space between the plasma electrode 130 and the lid 530. This process causes a current to flow through the lid 530 and melts a contact part, contacting with the package 520, with resistive heat occurring in the contact part to weld the lid 530 to the package 520. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013030691(A) 申请公布日期 2013.02.07
申请号 JP20110167250 申请日期 2011.07.29
申请人 SEIKO EPSON CORP 发明人 SAIBA KOJI
分类号 H01L23/02;B23K11/00;H03H3/02 主分类号 H01L23/02
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