METHOD FOR MANUFACTURING ELECTRONIC DEVICE MODULE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device module capable of simply performing formation and adhesion of a spacer for maintaining an interval between facing adherends and improving productivity.

SOLUTION: An adhesive film laminate 1A comprises: an adhesive film laminate 1A including an adhesive film 2 consisting of a three layer system that adhesive layers 2b and 2c made of a thermosetting epoxy-system adhesive are formed on both surfaces of a base material 2a consisting of a heat resistant resin film; a release film 3 having an adhesive layer bonded to the adhesive layer 2b or a release agent layer 3b; and a carrier film 4 having an adhesive layer 4b bonded to the adhesive layer 2c. The adhesive film laminate 1A prepared by heat-treating the epoxy-system adhesive solid and flexible at 25°C into a semi-cured state and die-cutting the adhesive film 2 in accordance with a dimension pattern of an electronic device is two-dimensionally arranged on the carrier film 4. The peeling film 3 is peeled to fix the adhesive layer 2b to a substrate and the carrier film 4 is peeled to transfer the die-cut adhesive film 5 on a substrate.

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