发明名称 |
SEMICONDUCTOR PACKAGE CONFIGURED TO ELECTRICALLY COUPLE TO A PRINTED CIRCUIT BOARD AND METHOD OF PROVIDING SAME |
摘要 |
In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base coupled to the lid and having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. At least one of the lid or the base can have at least one port hole. The one or more first electrically conductive leads can be configured to couple to the printed circuit board. Other embodiments are disclosed.
|
申请公布号 |
US2013032905(A1) |
申请公布日期 |
2013.02.07 |
申请号 |
US201013640723 |
申请日期 |
2010.04.30 |
申请人 |
UBOTIC INTELLECTUAL PROPERTY CO. LTD.;LO CHI KWONG;WAN LIK HANG;TAM MING WA |
发明人 |
LO CHI KWONG;WAN LIK HANG;TAM MING WA |
分类号 |
H01L29/84;H01L21/78 |
主分类号 |
H01L29/84 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|