SUBSTRATE FOR LED CHIP FIXATION AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a substrate for LED chip fixation which can manufacture a light emitting device such that light emitted from an LED chip (or luminescence light which is emitted by a wavelength converting substance excited with the emitted light) is taken out with high efficiency by improving the substrate for LED chip fixation manufactured by using a method which uses a flat metal plate as raw material to form a recess for LED chip storage and a projection portion for LED chip mounting through sheet metal processing.

SOLUTION: A substrate 10 for LED chip fixation is obtained by forming a recess 14 for storing an LED chip 20 on one surface of a metal plate 11 through sheet metal processing, and then forming a high-reflection coating 12 including a metal reflecting layer on the one surface of the metal plate 11 including at least a surface of the recess.

COPYRIGHT: (C)2013,JPO&INPIT