| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board capable of suppressing occurrence of unevenness of copper foil which becomes an external layer of the wiring board when manufacturing the wiring board by a coreless method using a support board. <P>SOLUTION: A method of manufacturing a wiring board includes: a process in which a metal foil plated laminated plate, adhesion layers and multilayer metal foil to be a support board are constituted in this order, insulation layers and metal foil to be a part of a laminate are constituted on the multilayer metal foil in this order and they are heated and pressed in a lump to form the laminate laminated on the support board; a process in which the metal foil and other metal foil of the multilayer metal foil are physically peeled to separate the laminate with one metal foil of the multilayer metal foil from the support substrate; and a process in which an external layer circuit is formed by etching the one metal foil of the separated laminate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
