| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board, which includes resin layers and ceramic layers, having improved electrical reliability for preventing the following defect occurence that since the ceramic layer has high rigidity, but is easy to break, a crack is easily produced in the ceramic layer when stress is applied to the wiring board, and if the crack extends and reaches wiring, disconnection is easily caused in the wiring, and electrical reliability of the wiring board is easily deteriorated as a result. <P>SOLUTION: In a structure of the wiring board having the resin layers in which a plurality of first inorganic particles 13a and second inorganic particles 13b each having a ceramic layer particle diameter of 3 nm or more and 110 nm or less are mixed between the resin layers, the first inorganic particles 13a are connected to each other through a first neck structure 17a, and resin is filled (third filled part 19c) between the particles (first gap G1). <P>COPYRIGHT: (C)2013,JPO&INPIT |
