发明名称 PRESSURE TEMPERATURE COMPOUND SENSOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a pressure temperature compound sensor device in which generation of electric poor connection, and increase of costs are suppressed. <P>SOLUTION: In a pressure temperature compound sensor device, each of a pressure sensor and a temperature sensor is electrically connected to an external element via a terminal, the pressure sensor and the terminal are supported by a support part, the temperature sensor is supported by the terminal, a fluid introduction hole formed at the support part has a first introduction hole and a second introduction hole, the temperature sensor has a thermosensitive element, a protection part, and a lead, one end of the lead is connected to the thermosensitive element, the other end of the lead is connected to the terminal, the thermosensitive element and the protection part are supported by the terminal via the lead, the protection part and the thermosensitive element are provided in the second introduction hole, horizontal width in a direction perpendicular to a center axis of the second introduction hole in a gap formed between the protection part and a wall surface of the second introduction hole is shorter than vibration width in which the thermosensitive element and the protection part vibrate by pressure application of fluid to be detected. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013029377(A) 申请公布日期 2013.02.07
申请号 JP20110164656 申请日期 2011.07.27
申请人 DENSO CORP 发明人 MATSUI HIROKI
分类号 G01K7/22;G01L19/00;G01L19/14 主分类号 G01K7/22
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