发明名称 Semiconductor Arrangement
摘要 A semiconductor arrangement includes a first and second controllable vertical n-channel semiconductor chip. Each of the controllable vertical n-channel semiconductor chips has a front side, a rear side opposite the front side, a front side main contact arranged on the front side, a rear side main contact arranged on the rear side, and a gate contact arranged on the front side for controlling an electric current between the front side main contact and the rear side main contact. The rear side contacts of the first and second semiconductor chips are electrically connected to one another.
申请公布号 US2013032855(A1) 申请公布日期 2013.02.07
申请号 US201113204347 申请日期 2011.08.05
申请人 INFINEON TECHNOLOGIES AG;MACHEINER STEFAN;MEISER ANDREAS PETER;THIELE STEFFEN 发明人 MACHEINER STEFAN;MEISER ANDREAS PETER;THIELE STEFFEN
分类号 H01L29/732;H01L29/78 主分类号 H01L29/732
代理机构 代理人
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