WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY BONDING ARRANGEMENT, AND THIN WAFER MANUFACTURING METHOD

摘要

PURPOSE: A wafer processing laminate, a wafer processing member, a temporary bonding arrangement and a method for manufacturing a thin wafer are provided to improve productivity by using a uniform thickness adhesive layer. CONSTITUTION: An adhesive layer(3) is formed on a supporter(2). A wafer is laminated on the adhesive layer. The adhesive layer includes a first adhesive layer and a second adhesive layer. The first adhesive layer is made of thermoplastic organopolysiloxane polymer(A) which can be peeled off the surface of the wafer. The second adhesive layer is laminated on the first adhesive layer. The second adhesive layer is made of thermoplastic siloxane polymer(B) which can be peeled off the supporter.