| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal storage material microcapsule which does not weather and of which microcapsule film has full solvent resistance. <P>SOLUTION: This thermal storage material microcapsule is made by covering the thermal storage material by a film made of a resin obtained by reacting a multivalent isocyanate compound with a compound having a plurality of amino groups and/or hydroxyl groups. The multivalent isocyanate compound uses at least one sort of the compounds expressed by a general formula (I). In the general formula (I), Z expresses a single-ring or multi-ring m-valence cycloalkane ring which may have a substituent group. m expresses an integer of 2-6. n expresses an integer of 1-6 which may be the same or may differ from each other. <P>COPYRIGHT: (C)2009,JPO&INPIT |
