发明名称 THERMAL HEAD
摘要 PURPOSE:To attain a small-sized thermal head having excellent adhesion with thermo sensitive paper and superior in resolution by a method wherein heating resistors and associated wiring parts are formed on the surface of an elliptic cylindrical substrate with larger curvature into desired patterns separately. CONSTITUTION:Using an elliptic cylindrical substrate 1 which has a section comprising moderate curved parts AB, CD and sharp curved parts BC, AD, resistant films 2 made of Ni-Cr, etc., conductive films (Cu films) 5 constituting wiring parts 3 and lead wire connecting parts 4, and heating resistors 6 in the desired patterns are formed on the surface of the curved part AB. Then, a protective film 7 made of SiC, etc. is formed thereon so as to obtain a thermal head (numeral 8 denotes lead wires welded to the connecting parts 4).
申请公布号 JPS57156275(A) 申请公布日期 1982.09.27
申请号 JP19810040967 申请日期 1981.03.20
申请人 MATSUSHITA DENKI SANGYO KK 发明人 OGATA KAZUO
分类号 B41J2/335;B41J2/345 主分类号 B41J2/335
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