| 摘要 |
<p>PURPOSE:To obtain an excellent contacting and adhesive properties, a low elastic coefficient and a low modulus of elasticity for the titled resin composition by a method wherein the resin composition, consisting of a polyfunctional epoxy compound, a hardening agent for epoxy resin and a chelating agent containing hydroxyl group and the like in a molecule, is used. CONSTITUTION:As the resin for semiconductor sealing, the resin composition consisting of a polyfunctional epoxy compound, a well-known hardening agent for epoxy resin consisted of phenol resin or formaldehyde resin, and the chelating agent containing at least one of a hydrocyl group, a phenylazo group and a Schiff group, is used. Using the resin of this composition, the contacting and adhesive properties can be improved, and the hardened material thus obtained has an excellent characteristics in low elastic coefficient, low expansion coefficient, heat-resisting property of high vitrification transition point and flexibility.</p> |
