| 摘要 |
PURPOSE:To increase the degree of hardness of the lead frame from that of the frame formed by Cu material only as well as to prevent the generation of warpage on the lead by a method wherein the Cu material is pressure-bonded to the metal other than the precious metals which will be used as a lead frame material. CONSTITUTION:The lead frame 1 is formed by Fe-Ni alloy, for example, and the chip placing stand 2 and the bonding part 3 of the lead frame are clad on a Cu material 4. According to this lead frame 1, as the cladding is perfomed on the surface using the Cu material, the direct bonding can be performed on an Au fine wire in the same manner as that which in performed on the lead frame 1 of the Cu material only. Also, as the hardness of the above material can be increased from that of the lead frame consisting of Cu material only, the generation of warpage of the lead can be prevented. |
