发明名称 |
MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD |
摘要 |
Disclosed is a multilayer wiring board having via-hole conductors for connecting a first copper wiring and a second copper wiring, the via-hole conductor including a metal portion and a resin portion. The metal portion includes a first metal region including a link of copper particles as a path for electrically connecting the first and second copper wirings; a second metal region mainly composed of at least one selected from tin, a tin-copper alloy, and a tin-copper intermetallic compound; and a third region mainly composed of bismuth. The copper particles forming the link are in plane-to-plane contact with one another. At least one of the first copper wiring and the second copper wiring is in plane-to-plane contact with the copper particles, and the portion where there is such a plane-to-plane contact is covered with at least a part of the second metal region. |
申请公布号 |
EP2555602(A1) |
申请公布日期 |
2013.02.06 |
申请号 |
EP20110854015 |
申请日期 |
2011.12.09 |
申请人 |
PANASONIC CORPORATION |
发明人 |
HIGUCHI, TAKAYUKI;HIRAI, SHOGO;HIMORI, TSUYOSHI;ISHITOMI, HIROYUKI |
分类号 |
H05K3/46;H01L23/12;H05K1/11;H05K3/40 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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