METHOD FOR MANUFACTURING BUMPS OF SEMICONDUCTOR CHIP

摘要

PURPOSE: A method for forming a bump of a semiconductor chip is provided to reduce packaging costs by thinly and finely forming the bump. CONSTITUTION: A first layer is formed on a chip(S110). A second layer is formed on the first layer(S120). The first layer and the second layer pass through the first hole(S130). A first metal layer is formed in the first hole(S140). A third layer is formed in the first layer and the first metal layer(S160). [Reference numerals] (AA) Start; (BB) End; (S110) Forming a first layer on a chip; (S120) Forming a second layer on the first layer; (S130) Forming a first hole passing through the first layer and the second layer; (S140) Forming a first metal layer on the first hole; (S150) Exposing the upper part of the first metal layer by removing the second layer; (S160) Forming a third layer; (S170) Forming a second hole passing through the third hole; (S180) Forming a second metal layer on the second hole; (S190) Removing the third layer