发明名称
摘要 A semiconductor device includes: a substrate; multiple first and second conductive type regions on the substrate for providing a super junction structure; a channel layer on the super junction structure; a first conductive type layer in the channel layer; a contact second conductive type region in the channel layer; a gate electrode on the channel layer via a gate insulation film; a surface electrode on the channel layer; a backside electrode on the substrate opposite to the super junction structure; and an embedded second conductive type region. The embedded second conductive type region is disposed in a corresponding second conductive type region, protrudes into the channel layer, and contacts the contact second conductive type region. The embedded second conductive type region has an impurity concentration higher than the channel layer, and has a maximum impurity concentration at a position in the corresponding second conductive type region.
申请公布号 JP5136674(B2) 申请公布日期 2013.02.06
申请号 JP20110112587 申请日期 2011.05.19
申请人 发明人
分类号 H01L29/78;H01L21/336;H01L29/06 主分类号 H01L29/78
代理机构 代理人
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