MAGNESIUM-BASED COMPOSITE MEMBER, HEAT DISSIPATION MEMBER, AND SEMICONDUCTOR DEVICE

摘要

A magnesium-based composite member (1A) is provided with a through hole (20A) through which a fastening member (100) for attachment to a fixing target is to be inserted. A substrate (10) is provided with a substrate hole (21) through which the fastening member (100) is to be inserted, and made of a composite material which is a composite of SiC and a matrix metal which is any of magnesium and a magnesium alloy. A receiving portion (22) is attached to the substrate (10) and made of a metal material different from the matrix metal. The receiving portion (22) is provided with a receiving portion hole (22h) through which the fastening member (100) is to be inserted, and at least a part of an inner circumferential surface of the through hole (20A) is formed from an inner circumferential surface of the receiving portion hole (22h).