| 摘要 |
<p>A protective coating 30 encapsulates bond pads 21 disposed on a substrate 20 of an optical communications module and extends in between the bond pads. The protective coating has characteristics that increase the dielectric resistances between adjacent bond pads on the substrate, protect the bond pads from moisture in the environment, and prevents, or at least reduces, ion migration between adjacent bond pads. In this way, the protective coating prevents, or at least reduces, corrosion growth that can lead to impedance degradation and electrical shorts between adjacent bond pads.</p> |
