VACUUM PLATING METHOD AND APPARATUS

摘要

PURPOSE: A vacuum plating device and a method are provided to prevent water in plating solution from being evaporated and frozen due to a low pressure in a vacuum, thereby allowing an electroless- or an electro-plating process to be smoothly implemented in the vacuum. CONSTITUTION: A vacuum plating device(10) includes a plating tank(100), a negative plate(220) to be plated, a vacuum chamber(300), a vacuum level controlling device(400), and a heating device(500). The negative plate and a positive plate(210) are horizontally or vertically arranged side by side to be separated from each other at regular intervals inside the plating tank. The plating tank is accommodated inside the vacuum chamber which is controlled to maintain a vacuum. The vacuum level controlling device is connected to the vacuum chamber, and controls vacuum level. The heating device controls the temperature of plating solution which is accommodated inside the plating tank. The vacuum plating device includes a rectifier(600) which is connected to the negative plate and the positive plate in order to apply an electric current. The vacuum plating device includes the plating solution which is an electroless-plating solution including a reductant.