发明名称 ELECTRODE PLATE MANUFACTURING APPARATUS
摘要 An electrode plate die-cutting apparatus of the present invention includes an original plate support portion 3 that supports an original plate of an electrode plate on a support surface 35, a driving portion that drives a cutting blade, which is arranged with a blade edge facing the original plate support portion 3, to move forward or backward, and a pressure adjusting portion 7 that suctions the original plate on the support surface 35 when the cutting blade is moving toward the original plate support portion 3 by the driving portion. For example, the pressure adjusting portion 7 includes a pipe 71, a first branch pipe 72, a first valve 75, and a decompressing portion 74. The vicinity of the support surface 35 is suctioned, and thus the electrode plate is adsorbed onto and fixed to the support surface 35 through a through hole 94 disposed in a sheet 90.
申请公布号 EP2555282(A1) 申请公布日期 2013.02.06
申请号 EP20110759518 申请日期 2011.03.24
申请人 MITSUBISHI HEAVY INDUSTRIES, LTD. 发明人 UEDA HISASHI
分类号 H01M4/04;B26D7/01;B26F1/40;H01M4/139 主分类号 H01M4/04
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