PROCESS INTEGRATION OF A SINGLE CHIP THREE AXIS MAGNETIC FIELD SENSOR
摘要
A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a "Z" axis magnetic field onto sensors orientated in the XY plane.
申请公布号
EP2553484(A1)
申请公布日期
2013.02.06
申请号
EP20110763327
申请日期
2011.03.29
申请人
EVERSPIN TECHNOLOGIES, INC.
发明人
WHIG, RENU;MATHER, PHILLIP;SMITH, KENNETH;AGGARWAL, SANJEEV;SLAUGHTER, JON