THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A memory card, a printed circuit board(PCB) for the memory card, and a manufacturing method are provided to reduce thickness of a gold plating layer and secure a plating layer satisfying intensity and a wire bonding property, thereby applying the plating layer to various PCBs. CONSTITUTION: A mounting unit(120) is formed on a first side of an insulating layer(110). A terminal unit(130) is formed on a second side of the insulating layer. The mounting unit and the terminal unit are formed with an alloy including copper. A first metal layer(150) is formed with metal including nickel. A second metal layer(160) is formed with metal including palladium. A third metal layer(170) is formed with metal including gold.