| 摘要 |
PURPOSE:To improve the current supply capability on the multilayer wiring of a semiconductor service as well as to contrive improvement in reliability by flattening the multilayer wiring by a method wherein a power source layer and a ground layer are formed into a large plane surface. CONSTITUTION:On the substrate 1a which functions as the first insulating layer, a ground layer 10 to be used to supply reference potential which is the grounding potential of a circuit, for example, is formed in deposition almost over the whole surface of the substrate 1. Then, a power source layer 12, to be used to supply power source potential to a pellet 3 through the second insulating layer 11, is formed almost over the whole surface of the substrate 1a. A power source wiring layer is formed with said two layers 10 and 11. A signal wiring layer 13 is formed on the power source layer 12 through the third insulating layer 11a. A number of signal wiring layers, consisting of the prescribed pattern, are formed by lamination. |
