| 摘要 |
PURPOSE:To simplify the mounting process of a semiconductor chip and to alleviate the adverse effect inflicting on a semiconductor chip by a method wherein the semiconductor chip is fixed with the spring of a lead frame. CONSTITUTION:A spring 7 is led out from the chip pad 2 provided on a lead frame. A semiconductor chip 1 is fixed in such a manner that its opposing side faces are pinched by the spring 7. The upper surface of the chip 1 is formed higher than the tip of the spring 7 so that there will be no hindrance for the bonding of a connecting wire 4. The chip 1 is mounted in such a manner that it is pressed down from above against the pad 2. As a result, the mounting process of the chip 1 can be simplified, and the adverse effect inflicting on the chip can also be alleviated.
|
