WAFER POLISHING APPARATUS

摘要

PURPOSE: A wafer polishing apparatus is provided to improve the uniformity of wafer polishing by uniformly distributing slurry on a surface between a polishing pad and a wafer. CONSTITUTION: A plurality of lower plate slurry supply holes are formed on a first polishing pad. The slurry supply holes passes through a body. A first polishing pad is attached to the upper side of a lower plate(230). A lower plate slurry supply nozzle(260) is connected to the plurality of lower plate slurry supply holes. A slurry supply unit(270) is connected to the lower plate slurry supply nozzle.