发明名称 |
Solid state image pick-up device and method for manufacturing the same with increased structural integrity |
摘要 |
There are provided image pickup devices capable of significantly increasing production yield and ensuring long-term reliability and a method for manufacturing the image pickup devices. This invention is characterized in that it has a large number of light-receiving portions 2 formed at a surface portion of a wafer 1 and a microlens 3 formed for each of the light-receiving portions, through electrodes 4 for performing supply of power to the light-receiving portions 2 and passing and reception of an electrical signal are provided all over the periphery of the wafer 1, one end of each through electrode 4 is connected to an electrode pad 4a which is connected to a wire leading to a light-receiving element at the surface portion of the wafer 1, the other end is connected to a wire through a back electrode 5, a rib 7 which serves as a partition portion arranged to surround the microlenses 3 on four sides is provided on the surface of the wafer 1, a transparent plate 8 of optical glass or the like is bonded to an upper surface of the rib 7 with adhesive, and a protective frame 10 is provided at a junction between the rib 7 and the transparent plate 8.
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申请公布号 |
US8368096(B2) |
申请公布日期 |
2013.02.05 |
申请号 |
US20050813242 |
申请日期 |
2005.12.27 |
申请人 |
AAC TECHNOLOGIES JAPAN R&D CENTER CO., LTD.;ASANO OSAMU;IWASA HITOO;TERAKAWA SUMIO;SHOUJI MASAMI |
发明人 |
ASANO OSAMU;IWASA HITOO;TERAKAWA SUMIO;SHOUJI MASAMI |
分类号 |
H01L33/00;H01L27/14;H01L27/146;H04N5/335 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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