| 摘要 |
PURPOSE: A method for manufacturing a wiring substrate is provided to laminate a solder resist film on a build-up layer for forming a first solder resist layer on a front side thereof to mount a semiconductor chip and to form a second solder resist layer to be thicker than the first solder resist layer on a back side, thereby improving reliability in connection to the semiconductor chip. CONSTITUTION: Build-up layers(3, 13) are formed respectively on a front side and a back side to face toward each surface by laminating one or more conductive layers and one or more resin insulation layers thereon. The build-up layers on the front side and the back side have at least one connection terminal(T1, T11) on their surfaces. A first solder resist layer(4) is formed by laminating a first solder resist film on the build-up layer on the front side. A second solder resist layer(14) is formed by laminating a second solder resist film on the build-up layer on the back side. The second solder resist film is thicker than the first solder resist layer on the build-up layer. |
