发明名称 |
Side view LED package structure |
摘要 |
A side view light emitting diode (LED) package structure includes a package housing, a side view LED chip and a thermal conductive member. The side view LED chip is enclosed by the package housing and an emitting direction of the side view LED chip is perpendicular to a thickness direction of a substrate. The thermal conductive member connected with the side view LED chip is disposed inside the package housing and a portion of which extends out of a dissipation opening of the package housing to be exposed so that heat of the side view LED chip is dissipated.
|
申请公布号 |
US8368110(B2) |
申请公布日期 |
2013.02.05 |
申请号 |
US20070902141 |
申请日期 |
2007.09.19 |
申请人 |
EVERLIGHT ELECTRONICS CO., LTD.;WU YI-TSUO;HSIEH CHUNG-CHUAN;CHANG CHIA-HSIEN |
发明人 |
WU YI-TSUO;HSIEH CHUNG-CHUAN;CHANG CHIA-HSIEN |
分类号 |
H01L33/00;H01L21/02;H01L33/48;H01L33/64 |
主分类号 |
H01L33/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|