COOLING SYSTEM FOR JUNCTION BOX

摘要

PURPOSE: A junction box cooling device is provided to improve the radiation performance by increasing the cooling speed for an active electronic element as a heat radiation structure is formed by installing a heat sink in a sub PCB(Printed Circuit Board). CONSTITUTION: A junction box cooling device comprises a main PCB(10), an upper case(11), a lower case(12), and a sub PCB(13). A molding unit sealing an IC(Integrated Circuit) chip and an active element is formed on one surface of the sub PCB and a heat sink(15) is attached on the other surface of the sub PCB. A tap(16) penetrates through both ends of a PCB so that both ends of the PCB are electrically connected to the main PCB. The PCB including a molding unit is mounted on the main PCB by a joining structure. The internal heat of the IC chip and the active element is emitted externally through a surface contact of the heat sink and the lower case.