发明名称 Semiconductor cooling apparatus
摘要 In some embodiments, a semiconductor cooling apparatus includes a monolithic array of cooling elements. Each cooling element of the monolithic array of cooling elements is configured to thermally couple to a respective semiconductor element of an array of semiconductor elements. At least two of the semiconductor elements have a different height and each cooling element independently flexes to conform to the height of the respective semiconductor element.
申请公布号 US8368208(B2) 申请公布日期 2013.02.05
申请号 US20100896054 申请日期 2010.10.01
申请人 RAYTHEON COMPANY;JOHNSON SCOTT T.;MERHI SHADI S. 发明人 JOHNSON SCOTT T.;MERHI SHADI S.
分类号 H01L23/34;H01L23/10 主分类号 H01L23/34
代理机构 代理人
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