发明名称 |
Semiconductor cooling apparatus |
摘要 |
In some embodiments, a semiconductor cooling apparatus includes a monolithic array of cooling elements. Each cooling element of the monolithic array of cooling elements is configured to thermally couple to a respective semiconductor element of an array of semiconductor elements. At least two of the semiconductor elements have a different height and each cooling element independently flexes to conform to the height of the respective semiconductor element.
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申请公布号 |
US8368208(B2) |
申请公布日期 |
2013.02.05 |
申请号 |
US20100896054 |
申请日期 |
2010.10.01 |
申请人 |
RAYTHEON COMPANY;JOHNSON SCOTT T.;MERHI SHADI S. |
发明人 |
JOHNSON SCOTT T.;MERHI SHADI S. |
分类号 |
H01L23/34;H01L23/10 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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