发明名称 Positive photosensitive resin composition, cured film, protecting film, insulating film and semiconductor and display devices using the same
摘要 The positive photosensitive resin composition of the present invention has a polyamide resin and a photosensitive agent, wherein the polyamide resin has a specific structure. The cured film of the present invention has a cured product of the positive photosensitive resin composition. The protecting film and insulating film of the present invention has the cured film each. The semiconductor device and display device of the present invention has the cured film each.
申请公布号 US8367283(B2) 申请公布日期 2013.02.05
申请号 US200913054889 申请日期 2009.07.16
申请人 SUMITOMO BAKELITE COMPANY, LTD.;TERAYAMA MIKI 发明人 TERAYAMA MIKI
分类号 G03F7/023 主分类号 G03F7/023
代理机构 代理人
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