发明名称 |
Electronics device module |
摘要 |
Disclosed is an electronic device module including a module substrate having first and second electronic device pair portions. The first electronic device pair portion may include a first and a second contact pad area and a first via area between the first and second contact pad areas. The first electronic device pair portion may also include a first layer and a second layer. The first layer may include a plurality of first lines connecting a plurality of contact pads in the first contact pad area on one side of the module substrate to a plurality of vias. The second layer may include a plurality of second lines connecting a plurality of contact pads in the second contact pad area to a plurality of vias in the via area. The second layer may also include a plurality of third lines connecting the first and second electronic device pair portions.
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申请公布号 |
US8369099(B2) |
申请公布日期 |
2013.02.05 |
申请号 |
US20100656451 |
申请日期 |
2010.01.29 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD.;KIM DO HYUNG;YANG JUNG-MO;YOO HYUN JUNG;SEO DONG-YOON;PARK IN-YOUNG |
发明人 |
KIM DO HYUNG;YANG JUNG-MO;YOO HYUN JUNG;SEO DONG-YOON;PARK IN-YOUNG |
分类号 |
H05K7/00 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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